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Features:
Our molded BGA socketing system offers a dependable, field-tested method for BGA device upgrade, replacement, repair, testing, and emulation in an economical and reliable alternative to soldering BGA devices directly to the mother board. (Patent Pending)
- Same footprint as device.
- Wide range of footprints.
- Process yields equivalent to direct attach.
- Eutectic solder balls reflow at standard solder process temperatures.
- Available in tape and reel packaging for automated assembly.
- Optional extraction slot aids adapter removal.
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